The SUPREME Pilot Line was represented at IMAPS Nordic NORDPAC 2026, one of the leading European conferences dedicated to advanced semiconductor packaging, held in Kista, Sweden, on 9–11 June 2026.
As part of the conference programme SUPREME was represented by Jorden Senior, Research Team Leader for Quantum Computing Hardware at VTT and coordinator of SUPREME Pilot Line. During this occasion, he contributed to a high-level panel discussion on the importance of advanced semiconductor packaging for quantum devices, power electronics and other emerging technologies. The discussion highlighted the growing role of packaging in enabling next-generation technologies and the value of cross-sector collaboration in addressing common technical challenges.
The panel emphasized that semiconductor packaging is a critical aspect of quantum hardware development. Topics such as thermal management, material compatibility and interconnect technologies become especially demanding at the millikelvin temperatures required for superconducting quantum devices, making advanced packaging a key enabler for future quantum systems.
The panel also demonstrated how challenges faced in quantum technologies increasingly overlap with those in power devices and other advanced semiconductor applications, reinforcing the importance of knowledge exchange across different industries.
SUPREME’s participation at IMAPS Nordic NORDPAC 2026 underlines the pilot line’s commitment to engaging with the broader semiconductor packaging community and fostering collaboration that supports the development of Europe’s quantum technology ecosystem.
